Thessaly: Foxconn-Radiall-Thales joint venture for semiconductors, with production scheduled to begin in 2029
The new alliance aims to strengthen European autonomy in the sector, with an investment of over €250 million and the creation of 800 jobs by 2033.
Signed today in Le Barp, near Bordeaux (Nouvelle-Aquitaine), in the presence of the French Minister for the Economy, Sebastian Martin, the launch of Tessalia, a joint venture between Foxconn (a global provider of electronic services), Radiall (a French manufacturer of high-performance interconnection solutions for industry) and Thales (a world leader in advanced technologies), dedicated to the assembly, packaging and testing of semiconductors.
According to a press release, Thessaly is aiming for European leadership in this sector with the goal of producing over 50 million components a year by 2033, with production expected to begin in late 2029.
The investment, which will also involve other stakeholders, could exceed €250 million by 2033.
It is expected that Thessaly will have 800 employees once production is fully up and running.
Tessalia will focus in particular on the aerospace, telecommunications infrastructure, automotive and medical sectors, and will utilise innovative encapsulation technology aimed at developing ultra-high-density packaging.
