Tessalia: Foxconn-Radiall-Thales semiconductor joint venture with production planned from 2029
The new alliance aims to strengthen European sovereignty in the sector, with an investment of over 250 million and 800 jobs by 2033.
Signed today and in Le Barp, near Bordeaux (Nouvelle-Aquitaine), in the presence of the French Minister for the Economy, Sebastian Martin, the birth of Tessalia, a joint venture between Foxconn (a global provider of electronic services), Radiall (a French manufacturer of high-performance interconnection solutions for industry) and Thales (a world leader in advanced technologies), dedicated to the assembly, packaging and testing of semiconductors.
Tessalia, reads a note, aimed at European sovereignty in this sector with the goal of producing over 50 million components per year by 2033, with estimated production to start at the end of 2029.
The investment, also involving other actors, could exceed €250 million by 2033.
Tessalia is expected to have 800 employees in full production.
Tessalia will work specifically for theaerospace, telecommunications infrastructure, automotive and medicine sectors and will use innovative encapsulation technology to develop ultra-high-density packaging.
